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| TICP107 SERIES SILICON CONTROLLED RECTIFIERS Copyright (c) 2000, Power Innovations Limited, UK JANUARY 1999 - REVISED JUNE 2000 G G G G G G G 1 A Continuous On-State Current 15 A Surge-Current Glass Passivated Wafer 400 V to 600 V Off-State Voltage IGT 50 A min, 200 A max di/dt 100A/s Package Options PACKAGE LP LP with fomed leads PACKING Bulk Tape and Reel PART # SUFFIX (None) R LP PACKAGE (TOP VIEW) G A K 1 2 3 MDC1AA LP PACKAGE WITH FORMED LEADS (TOP VIEW) G A K MDC1AB 1 2 3 absolute maximum ratings over operating junction temperature (unless otherwise noted) RATING Repetitive peak off-state voltage (see Note 1) Repetitive peak reverse voltage Continuous on-state current at (or below) 25C ambient temperature (see Note 2) Surge on-state current at (or below) 25C ambient temperature (see Note 3) Critical rate of rise of on-state current at 110C (see Note 4) Peak positive gate current (pulse width 300 s) Junction temperature range Storage temperature range Lead temperature 3.2 mm from case for 10 seconds TICP107D TICP107M TICP107D TICP107M SYMBOL VDRM VRRM IT(RMS) ITSM di/dt IGM TJ Tstg TL VALUE 400 600 400 600 1 15 100 0.2 -40 to +110 -40 to +125 230 UNIT V V A A A/s A C C C NOTES: 1. These values apply when the gate-cathode resistance RGK = 1 k. 2. These values apply for continuous dc operation with resistive load. 3. This value applies for one 50 Hz half-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium. 4. Rate of rise of on-state current after triggering with IG = 10mA, diG/dt = 1A/s. PRODUCT INFORMATION Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters. 1 TICP107 SERIES SILICON CONTROLLED RECTIFIERS JANUARY 1999 - REVISED JUNE 2000 electrical characteristics at 25C ambient temperature (unless otherwise noted) PARAMETER IDRM IRRM IGT VGT IH VT NOTE Repetitive peak off-state current Repetitive peak reverse current Gate trigger current Gate trigger voltage Holding current On-state voltage VD = rated VDRM VR = rated VRRM VAA = 12 V VAA = 12 V VAA = 12 V IT = 2 A (see Note 5) TEST CONDITIONS RGK = 1 k IG = 0 RL = 100 RL = 100 tp(g) 20 s tp(g) 20 s Initiating IT = 10 mA 50 0.4 MIN TYP MAX 20 200 200 1 2 1.4 UNIT A A A V mA V 5: This parameter must be measured using pulse techniques, tp = 1 ms, duty cycle 2 %. Voltage sensing-contacts, separate from the current carrying contacts, are located within 3.2 mm from the device body. PRODUCT INFORMATION 2 TICP107 SERIES SILICON CONTROLLED RECTIFIERS JANUARY 1999 - REVISED JUNE 2000 MECHANICAL DATA LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. (TO-92) LP003 (TO-92) 5,21 5,21 4,44 4,44 3,43 MIN. 2,67 2,03 4,19 3,17 2,67 2,03 LP003 Falls Within JEDEC Dimensions TO-226AA Dimensions Seating Plane 5,34 5,34 4,32 4,32 1,27 (see Note A) 12,7 MIN. 0,56 0,40 1 3 1,40 1,14 2,67 2,67 2,41 2,41 2 0,41 0,35 ALL LINEAR DIMENSIONS IN MILLIMETERS NOTE A: Lead dimensions are not controlled in this area. MDXXAX PRODUCT INFORMATION 3 TICP107 SERIES SILICON CONTROLLED RECTIFIERS JANUARY 1999 - REVISED JUNE 2000 MECHANICAL DATA LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LP003 (TO-92) - Formed Leads Version 5,21 4,44 3,43 MIN. 2,67 2,03 4,19 3,17 2,67 2,03 LP003 Falls Within JEDEC TO-226AA Dimensions 5,34 4,32 4,00 MAX. 0,56 0,40 1 2 3 2,90 2,40 0,41 0,35 2,90 2,40 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXAR PRODUCT INFORMATION 4 TICP107 SERIES SILICON CONTROLLED RECTIFIERS JANUARY 1999 - REVISED JUNE 2000 MECHANICAL DATA LPR tape dimensions LP Package (TO-92) Tape (Formed Lead Version) 5,21 4,44 3,43 MIN. 2,67 2,03 5,34 4,32 4,19 3,17 2,67 2,03 4,00 MAX. 0,56 0,40 0,41 0,35 13,70 11,70 32,00 23,00 27,68 17,66 2,50 MIN. 16,50 15,50 11,00 8,50 9,75 8,50 0,50 0,00 19,00 5,50 19,00 17,50 2,90 2,40 6,75 5,95 2,90 2,40 13,00 12,40 o 4,30 3,70 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXAS PRODUCT INFORMATION 5 TICP107 SERIES SILICON CONTROLLED RECTIFIERS JANUARY 1999 - REVISED JUNE 2000 IMPORTANT NOTICE Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements. PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS. Copyright (c) 2000, Power Innovations Limited PRODUCT INFORMATION 6 |
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